Plating Equipment Engineer

Job Description: As a Finish Team (Bond, CMP, Plating ) Equipment Engineer with Broadcom Limited’s Wireless Semiconductor Division (WSD), you will own and support equipment used to develop and execute advanced processes in our state of the art 8” wafer fabrication facility located along the Front Range in Northern Colorado. Working with Technology Development and Process Engineering, you will be challenged by new materials, applications and device architectures. You will be responsible for establishing robust equipment and processes through rigorous characterization and statistical validation before ramping and supporting them in high volume manufacturing.

Responsibilities

• Strong ownership of tactical execution and strategic improvement, including hardware and software optimization; reporting and ownership of related projects and metrics.
• Provide technical leadership in evaluating, troubleshooting, improving and maintaining equipment.
• Existing equipment upgrades and tool conversions with qualification support.
• Develop and implement preventative, predictive and high precision maintenance procedures.Implementation includes documenting procedures, as well as training and certifying personnel.
• Work with team members to meet organizational goals through the proactive identification of opportunities and the subsequent development and execution of corresponding projects.
• Collaborate with Process Engineering and R&D to conceptualize and progress opportunities that enable continued technological leadership; working across roles & teams, both internal and external, to deliver benefit to the business.
• Implement robust monitoring methodologies for equipment performance, preferably detecting deviation before product is impacted (e.g. SPC, FDC, baselining & matching).

Job Qualifications

• BS in ME, EE, ChemE, or Materials Science.
• 5+ years of experience with semiconductor or semiconductor adjacent processes and equipment is required. Experience with Cu Plating equipment is highly preferred (LAM Sabre, AMAT Sabre, Pactech).
• Detail oriented with strong fundamentals in core equipment engineering functions.
• Excellent diagnostic and troubleshooting skills for process/equipment interactions.
• Practical experience applying structured problem-solving methods.
• Practical experience in Fault Detection & Classification (FDC) systems, including setup, diagnostics and maintenance of those systems.
• Working knowledge and practical experience with SPC, DOE and statistical hypothesis testing.
• Mature data analysis skills using tools such as JMP, Minitab, Spotfire and Excel.
• Proficient in the use of hand tools, common hardware and fittings with a demonstrated track record of quality workmanship.
• Excellent verbal and written skills.Commitment to effective communication.
• Initiative to address and appropriately escalate problems to achieve rapid resolution.
• Basic understanding of MEMS and active device micro-fabrication techniques is highly desirable.
• U.S. Work Authorization.

Additional Job Description: Compensation And Benefits The annual base salary range for this position is $91,000 - $146,000

This position is also eligible for a discretionary annual bonus in accordance with relevant plan documents, and equity in accordance with equity plan documents and equity award agreements.

Broadcom offers a competitive and comprehensive benefits package: Medical, dental and vision plans, 401(K) participation including company matching, Employee Stock Purchase Program (ESPP), Employee Assistance Program (EAP), company paid holidays, paid sick leave and vacation time. The company follows all applicable laws for Paid Family Leave and other leaves of absence.

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