IC Package/System Design solution Engineer, Staff

Company Qualcomm Technologies, Inc.

Job Area Engineering Group, Engineering Group > Packaging Engineering

General Summary CHS (Central Hardware Systems) Architecture and Design team at Qualcomm is looking for highly talented, innovative, teamwork-oriented individuals for our cutting-edge technology work! By joining our team, you’ll collaborate with world-class engineers to create innovative solutions that push the limits of performance, energy efficiency, and scalability. Our focus is on designing XR packages and systems based on Qualcomm's Snapdragon SoC.

As an experienced CHS-AAD Engineer (individual contributor), you will collaborate with various cross-functional teams, including Technology team, SIPI, PDN, PCB design team, product management, and Chipset team. You will be responsible for creating high-performance package/SIPs designs and ensuring their successful transition to production for our XR products

• Position requires to be in San Diego full time, 5 days a week

Key Responsibilities

• IC top level floorplanning and understanding of hard macro block placement, padring, RDL and bump pattern/assignment.
• System level co-design methodology of IC, Package and PCB/Board.
• Concept analysis for new product package selection based on requirements for mechanical, thermal and electrical performance with the goal to achieve lowest system level cost.
• Package design flow methodology implementing high speed interface SI constraints for jitter, IR drop, cross-talk, and SSN specs.
• Experience with ORCAD schematic and Allegro design tools.
• Package design flow methodology implementing power distribution network (PDN) constraints for high speed processor cores (1GHz+) including design optimization techniques at the die/pkg/PCB levels.
• Understanding on PMIC and its eBOM.
• Designing PDN from PMIC to SOC to meet the given targets.
• Working with marketing/IC/product teams on competitive analysis and road mapping package technology for future products
• Designing High speed interfaces.
• Verification for packages and sips using Valor and ravel checks.
• Design review with suppliers and Osats.
• Evaluations on optimizing cost and area for a given package/SIP structure.

Qualifications

• Master's degree in Electrical or Computer Engineering or a related field.
• 7+ years of experience in package/SIP/PCB hardware design.
• Expertise designing high-speed, dense, multi-layer Packages, PCBs and systems.
• Proficiency in logic design, schematic capture, board layout tools, and testing.
• Strong knowledge of SIPI, PDN, thermal management, and compliance testing.
• Expertise in high-speed analog and digital design.
• Hands-on experience with PCIe, DDR, Ethernet, SerDes, and communication protocols (I2C/I3C/SPI/MDIO).
• Proven ability to work independently and collaboratively within a cross-functional team environment.
• Strong technical documentation skills and excellent written and verbal communication.

Preferred Qualifications

• PhD degree in Electrical or Computer Engineering or a related field.
• 5+ years of experience in package/PCB design.
• In-depth knowledge of PMIC, RF front end, Memories
• Working knowledge with scripting languages (Python, PERL, TCL).

Ideal Candidate Will Have

• Bachelor's degree in Electrical Engineering, Computer Science, or related field and 9+ years of Systems Engineering or related work experience.

OR

Master's degree in Electrical Engineering, Computer Science, or related field and 7+ years of Systems Engineering or related work experience.

OR

PhD in Electrical Engineering, Computer Science, or related field and 5+ years of Systems Engineering or related work experience.

Minimum Qualifications

• Bachelor's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 4+ years of System/Package Design/Technology Engineering or related work experience.

OR

Master's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 3+ years of System/Package Design/Technology Engineering or related work experience.

OR

PhD in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 2+ year of System/Package Design/Technology Engineering or related work experience.

Qualcomm is an equal opportunity employer. If you are an individual with a disability and need an accommodation during the application/hiring process, rest assured that Qualcomm is committed to providing an accessible process. You may e-mail disability-accomodations@qualcomm.com or call Qualcomm's toll-free number found here. Upon request, Qualcomm will provide reasonable accommodations to support individuals with disabilities to be able participate in the hiring process. Qualcomm is also committed to making our workplace accessible for individuals with disabilities. (Keep in mind that this email address is used to provide reasonable accommodations for individuals with disabilities. We will not respond here to requests for updates on applications or resume inquiries).

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Pay Range And Other Compensation & Benefits $154,000.00 - $231,000.00

The above pay scale reflects the broad, minimum to maximum, pay scale for this job code for the location for which it has been posted. Even more importantly, please note that salary is only one component of total compensation at Qualcomm. We also offer a competitive annual discretionary bonus program and opportunity for annual RSU grants (employees on sales-incentive plans are not eligible for our annual bonus). In addition, our highly competitive benefits package is designed to support your success at work, at home, and at play. Your recruiter will be happy to discuss all that Qualcomm has to offer – and you can review more details about our US benefits at this link.

If you would like more information about this role, please contact Qualcomm Careers.