Skill - Advanced package Design (APD)

Location- Bangalore

Experience - 5+years

Good hands-on experience in IC Package Substrate design and Interposer Design
Familiarity with various package configuration and assembly/substrate technology (wirebond, flipchip, COF)
Good knowledge of substrate structure, design rules and material property
Experience of Cadence Allegro tools - Allegro Package Design+/ Allegro SIP, or equivalent
Experience of Synopsys 3D IC compiler and ICC2 is added advantage
Design experience with MCM/SiP packages, module schematic and layout design experience
Knowledge of Complex, High-Speed PCB, and IC Packaging
Understanding/ experience in scripting – Perl/ SKILL programming
Understanding of DRC and DFM (Design For Manufacturing)
Understanding in SI/PI tools, package model extraction, S-parameter

Advanced package Design (APD)

The Opportunity