Senior Director, Systems Technology Development

Company Qualcomm Technologies, Inc.

Job Area Engineering Group, Engineering Group > ASICS Engineering

General Summary We are seeking a Senior Director of Systems Technology Development to provide technical and execution leadership across our semiconductor technology portfolio. This role is designed for a highly experienced industry leader with deep hands‑on expertise in semiconductor technology development and a proven ability to deliver advanced silicon solutions into high‑volume products.

The ideal candidate brings strong execution focus across process, chiplets, heterogeneous integration including memory, and interconnect technologies , with the ability to evaluate and drive power, performance, area, and cost (PPAC) tradeoffs. This role will guide technology decisions that enable differentiated products across mobile, IoT, data center, automotive, and XR business units, particularly as the industry moves beyond traditional Moore’s Law scaling.

• Position requires to be onsite in San Diego, 5 days a week**

Key Responsibilities Technology Execution & Integration Leadership

• Lead the execution of advanced semiconductor technologies from concept through manufacturing readiness.
• Drive technology integration across logic, memory, interconnect, and chiplets with a focus on robust, manufacturable solutions.
• Translate high‑level product and architectural requirements into clear technology requirements and implementation plans.

PPAC Optimization & Tradeoff Analysis

• Own and influence PPAC tradeoff decisions across process nodes, design choices, and chiplet approaches.
• Evaluate competing technology options to balance performance targets, power efficiency, die area, yield, and cost.
• Guide teams in making data‑driven decisions that optimize end‑product KPIs while maintaining schedule and risk discipline.

Cross-Functional Technical Leadership

• Interface closely with silicon design, process integration, packaging, product engineering, and manufacturing teams.
• Collaborate with internal domain experts to ensure cohesive execution across technology boundaries.
• Provide technical leadership and mentorship to senior engineers and technology leads across the organization.

Technology Roadmaps & Industry Engagement

• Influence medium‑ and long‑term technology roadmaps aligned with business and product needs.
• Help evolve the organization from a transistor‑scaling‑centric mindset toward technology and integration‑driven differentiation, including advanced packaging and heterogeneous integration.
• Engage with foundries, and key technology suppliers to assess readiness, risk, and scalability of emerging technologies.

Executive & Stakeholder Communication

• Clearly communicate technology risks, tradeoffs, and execution plans to executive stakeholders.
• Serve as a trusted technical advisor to leadership on technology investment decisions.
• Represent the company in senior‑level discussions with external partners and ecosystem leaders.

Ideal candidate will have

• 20+ years of experience in semiconductor technology development, process integration, or advanced silicon platforms.
• Deep expertise in logic process technologies, memory integration, interconnect, and chiplet heterogeneous integration.
• Strong track record of executing complex technologies into production.
• Demonstrated experience making and defending PPAC tradeoff decisions.
• Proven ability to lead and influence large, cross‑functional engineering teams.
• Experience working directly with foundries, and other semiconductor suppliers.

Preferred Qualifications

• Industry recognition as a senior technical leader in semiconductor technology execution or integration.
• Experience supporting multiple market segments (mobile, IoT, data center, automotive, XR).
• Background in 2.5D/3D, chiplets, heterogeneous integration.
• Strong understanding of manufacturing constraints, yield learning, and cost scaling.

Impact In this role, you will directly shape the execution and integration of next‑generation semiconductor technologies , ensuring optimal PPAC outcomes at System level. Your leadership will enable high‑impact products across diverse business units while positioning the organization for sustained innovation beyond traditional scaling approaches.

Minimum Qualifications

• Bachelor's degree in Science, Engineering, or related field and 10+ years of ASIC design, verification, validation, integration, or related work experience.

OR

Master's degree in Science, Engineering, or related field and 9+ years of ASIC design, verification, validation, integration, or related work experience.

OR

PhD in Science, Engineering, or related field and 8+ years of ASIC design, verification, validation, integration, or related work experience.

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Pay Range And Other Compensation & Benefits $249,900.00 - $374,900.00

The above pay scale reflects the broad, minimum to maximum, pay scale for this job code for the location for which it has been posted. Even more importantly, please note that salary is only one component of total compensation at Qualcomm. We also offer a competitive annual discretionary bonus program and opportunity for annual RSU grants (employees on sales-incentive plans are not eligible for our annual bonus). In addition, our highly competitive benefits package is designed to support your success at work, at home, and at play. Your recruiter will be happy to discuss all that Qualcomm has to offer – and you can review more details about our US benefits at this link.

If you would like more information about this role, please contact Qualcomm Careers.