SoC Thermal Engineer

Company Qualcomm India Private Limited

Job Area Engineering Group, Engineering Group > Hardware Engineering

General Summary As a leading technology innovator, Qualcomm pushes the boundaries of what's possible to enable next-generation experiences and drives digital transformation to help create a smarter, connected future for all. As a Qualcomm Hardware Engineer, you will plan, design, optimize, verify, and test electronic systems, bring-up yield, circuits, mechanical systems, Digital/Analog/RF/optical systems, equipment and packaging, test systems, FPGA, and/or DSP systems that launch cutting-edge, world class products. Qualcomm Hardware Engineers collaborate with cross-functional teams to develop solutions and meet performance requirements.

Minimum Qualifications

• Bachelor's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 3+ years of Hardware Engineering or related work experience.

OR

Master's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 2+ years of Hardware Engineering or related work experience.

OR

PhD in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 1+ year of Hardware Engineering or related work experience.

Job Title: SoC Thermal Engineer

• SOC Thermal analysis methodology development: encompassing SoC, package and systems, for various Qualcomm products going into smartphones, laptops, automotives and virtual reality headsets.
• Developing strategies to predict and improve thermally constrained scores (AnTuTu/Geekbench) and also measure/tune it on post-Si platforms, including infrared imaging.
• Thermal measurement : The candidate will be responsible for improving thermal mitigation strategies through power and thermal management to achieve optimal system thermal performance.

Skills

• Should possess strong analytical skills and mathematical modeling abilities.
• Provide thermal analysis throughout the SoC product development cycle to identify and mitigate thermal risks, including post-silicon validation and customer collaboration.
• Perform SoC-level thermal analysis to support architecture, product specifications, and Power-Performance-Area-Thermal optimization. Recommend thermal mitigation strategies.
• Develop advanced thermal methodologies, software tools, and scalable processes; collaborate with cross-functional teams to drive efficiency and achieve goals.
• Knowledge of SOC stack up is must
• Good knowledge of scripting in PERL/Python required; some exposure to Machine Learning algorithms/frameworks will be a plus.
• Need to have thorough knowledge of heat transfer mechanisms and CFD.
• Proficiency with state-of-the-art thermal analysis tools – Ansys Icepak/Flotherm
• Thermal Measurement will be preferred skill

Applicants : Qualcomm is an equal opportunity employer. If you are an individual with a disability and need an accommodation during the application/hiring process, rest assured that Qualcomm is committed to providing an accessible process. You may e-mail disability-accomodations@qualcomm.com or call Qualcomm's toll-free number found here. Upon request, Qualcomm will provide reasonable accommodations to support individuals with disabilities to be able participate in the hiring process. Qualcomm is also committed to making our workplace accessible for individuals with disabilities. (Keep in mind that this email address is used to provide reasonable accommodations for individuals with disabilities. We will not respond here to requests for updates on applications or resume inquiries).

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