Senior Principal Applications Engineer

NXP’s SerDes Networking Solution (SNS) team delivers open-standard Automotive SerDes Alliance (ASA) Motion Link multi-Gigabit connectivity for next-generation sensors and vehicle displays. As part of the Applications Engineering team, you will work with both internal engineering teams to develop collaterals to ease customer adoption of our SerDes solutions, as well as with NXP’s field teams and customer engineering teams to ensure successful system design and bring-up.

Key Responsibilities

• Collaborate with IC design, systems, FW, and test teams to translate field issues and customer requirements into product improvements and new features.
• Review customer schematics and layouts for signal‑integrity and power‑integrity best practices (impedance control, terminations, return paths, via design, reference plane strategy).
• Lead board‑level bring‑up and validation using oscilloscopes, protocol analyzers; generate test reports and recommendations.
• Provide on‑site or remote debug support for complex customer issues.
• Develop and maintain application collateral: reference designs, layout guidelines, design checklists, characterization reports, application notes, training materials.
• Participate in trade shows and provide FAE training

Qualifications

• Bachelor’s degree or above in Electrical/Electronic Engineering or related field.
• Extensive experience (12+ years) in hardware design, applications engineering, or system validation.
• Strong understanding of high‑speed SerDes fundamentals: channel loss, reflections, return loss, insertion loss, ISI, jitter, equalization, and clocking.
• Demonstrated experience with multi‑Gbps serial links (e.g., Ethernet, PCIe, DP, USB3.x/USB4, proprietary SerDes).
• Proficiency with SI/PI tools and simulations (e.g., S‑parameter analysis, eye/jitter simulations) and comfort interpreting simulation and measurement correlation.
• Hands‑on experience using lab equipment: high‑bandwidth oscilloscopes, TDR, VNA, BERT, protocol analyzers, logic analyzers, and related tools.
• Strong skills in PCB design for high‑speed: layer stack‑up, routing constraints, differential pairs, reference planes, decoupling, and power delivery.
• Excellent communication and presentation skills to explain complex technical topics to both expert and non‑expert audiences. ⁽⁵⁾
• Ability to work effectively with global, cross‑functional teams (design, systems, test, marketing, field).

The base salary range for this position is as mentioned below per year. We also provide competitive benefits, incentive compensation, and/or equity for certain roles.

Company benefits include health. dental, and vision insurance. 401(k), and paid leave. Please note that the base salary range (OR hourly rate) is a guideline, and individual total compensation may vary based on a number of factors such as qualifications, skill level, work location, and other business and organizational needs. This base pay range is specific to California and is not applicable to other locations. A reasonable estimate of the base salary range as of the date of this posting is:

$186,200 to $256,100 annually

More information about NXP in the United States...

NXP is an Equal Opportunity/Affirmative Action Employer regardless of age, color, national origin, race, religion, creed, gender, sex, sexual orientation, gender identity and/or expression, marital status, status as a disabled veteran and/or veteran of the Vietnam Era or any other characteristic protected by federal, state or local law. In addition, NXP will provide reasonable accommodations for otherwise qualified disabled individuals.